Paste:
No Clean Paste, Water Wash Paste, Solder Paste
When purchasing paste products, you must select overnight shipping.
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Indium5.1 w/ SAC387IPN: PSOT-83917
Price: $120.00
Indium5.1 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superb wetting to Pb-Free metallizations in combination with clear residue and low voiding on microvia.
Indium5.1 with Sn95.5Ag3.8Cu0.7 Details… -
Indium5.1 w/ SAC305
IPN: PSOT-83918
Price: $120.00
Indium5.1 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superb wetting to Pb-Free metallizations in combination with clear residue and low voiding on microvia.
Indium5.1 with Sn96.5Ag3.0Cu0.5 Details… -
Indium3.1 w/ SAC387IPN: PSOT-83874
Price: $120.00
Indium3.1 with Sn95.5Ag3.8Cu0.7
Features
• Exceptional printing
• Long stencil life
• Wide reflow profile window
• Outstanding slump resistance
• Excellent wetting compatibility
• Superior fine-pitch soldering ability
• Low voiding
• Low foam Details… -
Indium3.1 w/ SAC305
IPN: PSOT-83875
Price: $120.00
Indium3.1 with Sn96.5Ag3.0Cu0.5
Features
• Exceptional printing
• Long stencil life
• Wide reflow profile window
• Outstanding slump resistance
• Excellent wetting compatibility
• Superior fine-pitch soldering ability
• Low voiding
• Low foam Details… -
Indium5.8LS w/ SAC387IPN: PSOT-83754
Price: $120.00
Indium5.8LS with Sn95.5Ag3.8Cu0.7
Indium5.8 LS is a halide-free, no-clean solder paste specifically formulated for low flux spatter. This material is designed to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high speed as well as high mix surface mount lines. Indium5.8 LS solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications. Details… -
Indium5.8LS w/ SAC305IPN: PSOT-83753
Price: $120.00
Indium5.8LS with Sn96.5Ag3.0Cu0.5
Indium5.8 LS is a halide-free, no-clean solder paste specifically formulated for low flux spatter. This material is designed to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high speed as well as high mix surface mount lines. Indium5.8 LS solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications. Details… -
NC-SMQ230 w/ SAC387IPN: PSOT-82797
Price: $120.00
NC-SMQ230 with Sn95.5Ag3.8Cu0.7
NC-SMQ230 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag/Bi and Sn/Ag Lead-free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high-speed as well as high-mix surface mount lines. NC-SMQ230 solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications. Details… -
NC-SMQ230 w/SAC305IPN: PSOT-83495
Price: $120.00
NC-SMQ230 with Sn96.5Ag3.0Cu0.5
NC-SMQ230 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag/Bi and Sn/Ag Lead-free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high-speed as well as high-mix surface mount lines. NC-SMQ230 solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications. Details… -
No-Clean Solder Paste for Fine Pitch PrintingIPN: Pasteot-83229-03-1000g12C
Price: $190.00
NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent fine pitch deposition. Details…
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No-Clean Solder Paste for Fine Pitch PrintingIPN: Pasteot-83228-02-500g6C
Price: $100.00
NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent fine pitch deposition. Details…
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No Clean DispensingIPN: Pasteot-83232-03-1000g12C
Price: $200.00
Premium No-Clean Details…
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No Clean Dispensing
IPN: Pasteot-83231-02-500g6C
Price: $105.00
Premium No-Clean Details…
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No Clean Stencil Printing
IPN: Pasteot-83230-01-500g4J
Price: $105.00
Premium No-Clean Details…