Indium3.1:
Printing
Printing The sharp print definition of Indium3.1 is ideal for fine-pitch applications. The unprecedented stencil life of this water-soluble product virtually eliminates waste of solder paste.
Wetting
Indium3.1 exhibits excellent wetting under both air and nitrogen reflow atmosphere. The solder joints yielded are shiny and smooth, including those of ultra fine-pitch components. Indium3.1 has low voiding performance,
including joints of BGAs and CSPs.
Cleaning
Residue Cleaning: Indium3.1 residue is easily cleaned with water at no less than 60 psi and 55°C. The optimal spray pressure and temperature are a function of the board complexity and the effi ciency of cleaning equipment.
Stencil Cleaning: This is best performed using an automated stencil cleaning system for both stencil and misprint cleaning to prevent extraneous solder particles. Most commercially available stencil cleaners and isopropyl alcohol (IPA) work well.
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Indium3.1 w/ SAC387IPN: PSOT-83874
Price: $120.00
Indium3.1 with Sn95.5Ag3.8Cu0.7
Features
• Exceptional printing
• Long stencil life
• Wide reflow profile window
• Outstanding slump resistance
• Excellent wetting compatibility
• Superior fine-pitch soldering ability
• Low voiding
• Low foam Details… -
Indium3.1 w/ SAC305
IPN: PSOT-83875
Price: $120.00
Indium3.1 with Sn96.5Ag3.0Cu0.5
Features
• Exceptional printing
• Long stencil life
• Wide reflow profile window
• Outstanding slump resistance
• Excellent wetting compatibility
• Superior fine-pitch soldering ability
• Low voiding
• Low foam Details…