Indium5.1:
Indium5.1 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superb wetting to Pb-Free metallizations in combination with clear residue and low voiding on microvia.
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Indium5.1 w/ SAC387IPN: PSOT-83917
Price: $120.00
Indium5.1 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superb wetting to Pb-Free metallizations in combination with clear residue and low voiding on microvia.
Indium5.1 with Sn95.5Ag3.8Cu0.7 Details… -
Indium5.1 w/ SAC305
IPN: PSOT-83918
Price: $120.00
Indium5.1 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superb wetting to Pb-Free metallizations in combination with clear residue and low voiding on microvia.
Indium5.1 with Sn96.5Ag3.0Cu0.5 Details…