Indium5.8LS:
Indium5.8 LS is a halide-free, no-clean solder paste specifically formulated for low flux spatter. This material is designed to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high speed as well as high mix surface mount lines. Indium5.8 LS solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications.
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Indium5.8LS w/ SAC387IPN: PSOT-83754
Price: $120.00
Indium5.8LS with Sn95.5Ag3.8Cu0.7
Indium5.8 LS is a halide-free, no-clean solder paste specifically formulated for low flux spatter. This material is designed to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high speed as well as high mix surface mount lines. Indium5.8 LS solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications. Details… -
Indium5.8LS w/ SAC305IPN: PSOT-83753
Price: $120.00
Indium5.8LS with Sn96.5Ag3.0Cu0.5
Indium5.8 LS is a halide-free, no-clean solder paste specifically formulated for low flux spatter. This material is designed to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high speed as well as high mix surface mount lines. Indium5.8 LS solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications. Details…