NC-SMQ230:
NC-SMQ®230 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag/Bi and Sn/Ag Lead-free alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high-speed as well as high-mix surface mount lines. NC-SMQ®230 solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications.
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NC-SMQ230 w/ SAC387IPN: PSOT-82797
Price: $120.00
NC-SMQ230 with Sn95.5Ag3.8Cu0.7
NC-SMQ230 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag/Bi and Sn/Ag Lead-free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high-speed as well as high-mix surface mount lines. NC-SMQ230 solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications. Details… -
NC-SMQ230 w/SAC305IPN: PSOT-83495
Price: $120.00
NC-SMQ230 with Sn96.5Ag3.0Cu0.5
NC-SMQ230 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag/Bi and Sn/Ag Lead-free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today's high-speed as well as high-mix surface mount lines. NC-SMQ230 solder paste meets or surpasses all ANSI/J-STD-004 and -005 specifications. Details…